Again, an important explanation of the detection method of the temperature and humidity meter of the high and low temperature damp heat test chamber

Again, an important explanation of the detection method of the temperature and humidity meter of the high and low temperature damp heat test chamber
The high and low temperature damp heat test room is also called the step-in constant temperature and humidity test room. The simple distinction is that the constant temperature and humidity test room is more complicated than the small constant temperature and humidity chamber instrument, so it should be frequently repaired to ensure the normal operation of the equipment.
There are usually the following points for the following troubleshooting methods:
First, the contrast hair
The specific method is to let the faulty meter and the normal meter run under the same conditions, and then detect the signals of some points and then compare the two groups of signals measured. If there are differences, it can be concluded that the fault is here. This method requires the maintenance personnel to have considerable knowledge and skills.
Two instruments of the same model are required and one is in normal operation. Use this method to have the necessary equipment, such as: multimeter, oscilloscope, etc. According to the nature, voltage comparison, waveform comparison, static impedance comparison, output comparison, current comparison, etc.
Second, the capacitor bypass method
When a circuit produces a strange phenomenon, such as a display disorder, the capacitor bypass method can be used to determine the portion of the circuit that is likely to fail.
Third, isolation method
Fault isolation does not require the same type of equipment or spare parts for comparison and is safe and reliable. According to the fault detection flow chart, the segmentation and encirclement gradually narrows the fault search range, and then cooperates with the signal comparison and component exchange methods, and generally finds the fault location.
Fourth, tapping
It is often encountered when the instrument is running out of time, which is mostly caused by poor contact or solder joints. For this case, tapping and hand pressing can be used.
The so-called "knocking" is to gently knock the board or part through a small rubber hammer or other tapping object to see if it will cause an error or a downtime. The so-called "hand pressure" is when the fault occurs, after the power is turned off, the inserted components and the plug and the seat are again pressed by hand, and then the power is turned on to try to eliminate the fault. If you find that the shell is normal, and then knocking is not normal, then Zui will first re-insert all the joints and try again. If it is not successful, you have to find another way.
Fifth, the state adjustment method
Generally speaking, before the fault is determined, do not touch the components in the circuit, especially the adjustable device, especially the potentiometer. However, if the paperless recorder selects the pre-measurement measure in advance (for example, position mark or measured voltage value or resistance value before untouching), it is allowed to be touched if necessary. Maybe after the change, sometimes the fault will be eliminated.
The power supply and ground of the IC; the transistor circuit is connected across the base input or the collector output to observe the effect on the fault phenomenon. If the color paperless recorder's capacitor bypass input is inactive and the fault disappears when bypassing its output, it is determined that the fault is present in this stage of the circuit.
Sixth, observation method
Use vision, smell, and touch. In some cases, damaged components will change color, blister or burnt spots; burnt devices will produce some special odor; short-circuited chips will be hot; visible or desoldered parts can also be observed with the naked eye. .
Seven, riding the shoulder method
The shoulder riding method is also called parallel method. Place a good IC chip on the chip to be inspected, or connect good components (resistance capacitors, diodes, transistors, etc.) in parallel with the components to be inspected, and keep in good contact. If the fault is caused by an open circuit inside the device or If you have bad contact, etc., you can use this method to eliminate it.
Eight, replacement method
1) Component replacement method: Two instruments of the same type are required or there are enough spare parts. Replace a good spare with the same component on the faulty machine to see if the fault is eliminated.
2) Function replacement method: When the function of a certain part of the faulty machine is lost, because the spare parts of the original spare parts cannot be found at one time, according to the circuit principle of the part, the functions of purchasing or making the electrical parameters are the same or close to the parts, and the same can be achieved. Repair the purpose of the instrument.
Nine, lifting temperature method
Sometimes, the instrument works for a long time, or when the working environment temperature is high in summer, it will be faulty. The shutdown check is normal. After stopping for a while, the machine is turned on again and normal. After a while, it fails again. This phenomenon is caused by the poor performance of individual ICs or components, and the high-temperature characteristic parameters fail to meet the requirements of the index. In order to find out the metal processing network of the cause of the failure, the temperature rise and fall method can be employed.
The so-called cooling, that is, when the fault occurs, use the cotton fiber to wipe the anhydrous alcohol in the part that may be faulty, to cool it, and observe whether the fault is eliminated. The so-called heating is artificially raising the ambient temperature, such as using a soldering iron to close the suspected part (be careful not to raise the temperature too high to damage the normal device) to see if the fault occurs.
X. Exclusion method
The so-called elimination method is a method for judging the cause of the failure by plugging in some boards and devices inside the machine. When the instrument is restored after removing a certain board or device, it indicates that the fault occurred there. This method is also a method that the technician should master and skillfully use. Maintenance method of constant humidity test box instrument

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