Foundry giant UMC recently announced that in cooperation with ARM, UMC 14 nm FinFET process based on the PQV test chip has been tape (tape out), on behalf of the ARM Cortex-A series of processor cores by UMC high-end wafer process And UMC also announced an expanded partnership with Synopsys to include Synopsys' Embedded Memory IP and DesignWare STAR System Test and Repair Solutions on UMC's second PQV 14nm test chip.
Continuation of 14-nanometer Partnership with ARM Continued Since then, ARM Artisan entity IP has been successfully integrated into UMC's 28-nm High K / Metal gate production process. The UF 14 nanometer FinFET process technology verification is the first step in the UFID FinFET process to launch other IP ecosystems, including the foundation IP and the ARM processor physical design.
Will Abbey, general manager of ARM's Entity IP Design Group, said: "ARM and UMC have been working together for several generations of technology and have achieved great results. The Cortex-A series of core test chips from UMC's 14nm FinFET process was formally finalized, Is very exciting.ARM and UMC will continue to maintain close cooperation for the development of this high-level process technology. "
In addition, UMC and Synopsys developed the second 14-nanometer PQV to provide more silicon data, allowing UMC to further fine-tune its 14-nanometer FinFET process for optimal power, performance and area performance. Both parties have successfully designed and finalized the first UMC 14nm FinFET PQV, which includes the Synopsys DesignWare Logic Library and the StarRC parasitic extraction tool, while PQV continues to expand its partnership.
John Koeter, vice president of IP & Prototyping Marketing at Synopsys, said: "The partnership between Synopsys and UMC expands on the common goal of helping chip design companies unite our DesignWare silicon solutions at UMC, To its system-on-a-chip design. With more than 45 FinFET test chip designs now available, Synopsys will continue to work hard on delivering high-quality silicon intelligence to FinFET processes that will allow chip design companies to reduce their integration risk , And speed up the production schedule. "
UMC said the company's 14-nanometer FinFET process has demonstrated excellent 128mb SRAM product yield, and is expected by the end of 2015 to accept customer sprites.